Name: Design for High Performance, low Power, and Reliable 3d Integrated Circuits (en Inglés)
Price: 544.93 PEN
Availability: InStock
Author: Sung Kyu Lim
ISBN: 9781489986962

portada Design for High Performance, low Power, and Reliable 3d Integrated Circuits (en Inglés)

Formato

Libro Físico

Editorial

Springer

Autor

Sung Kyu Lim

Idioma

Inglés

N° páginas

588

Encuadernación

Tapa Blanda

ISBN13

9781489986962

N° edición

2013th

Design for High Performance, low Power, and Reliable 3d Integrated Circuits (en Inglés)

Sung Kyu Lim (Autor) · Springer · Tapa Blanda

Libro Físico

S/ 544,93

S/ 1.089,87

Ahorras: S/ 544,93

50% descuento

Envío normal

Origen: Estados Unidos (Costos de importación incluídos en el precio)

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Reseña del libro "Design for High Performance, low Power, and Reliable 3d Integrated Circuits (en Inglés)"

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.