This book is a definitive guide to improving yield and reliability in the modern semiconductor industry. Blending academic research with industrial expertise, it unveils the innovative Build-In Reliability (BIR) platform.

The book consists of 20 chapters, organized into four technical parts, deep diving into operational excellence and future perspectives. It emphasizes BIR s core components Wafer-Level Reliability (WLR) and the AI-enhanced Build-In Reliability Diagnosis System (BIRDS), a knowledge-based tool designed to enable early detection of non-conformance.

Part 1 introduces the BIR framework. Subsequent parts address completeness and timeliness, which are essential for establishing robust systems to enhance yield and reliability. Part 4 discusses emerging trends, including 3D packaging technologies (e.g., CoWoS), neural network-driven reliability predictions, Prognostic Health Management (PHM) for predictive maintenance, and the strategic importance of Diversity, Equity, and Inclusion (DEI) and globalization in overcoming industry challenges.

This book covers a wide range of topics, including logic devices (down to 2nm), volatile and non-volatile memory tests, laboratory management, tool design, integrated circuit (IC) qualification, supplier and consumables management, statistical process control (SPC), and a novel multi-level quality and reliability training and certification framework. It also addresses the development of